Technologies for 3D Heterogeneous Integration

3D-Integration is a promising technology towards higher interconnect densities and shorter wiring lengths between multiple chip stacks, thus achieving a very high performance level combined with low power consumption. This technology also offers the possibility to build up systems with high complexity just by combining devices of different technologies. For ultra thin silicon is the base of this integration technology, the fundamental processing steps will be described, as well as appropriate handling concepts. Three main concepts for 3D integration have been developed at IZM. The approach with the greatest flexibility called Inter Chip Via - Solid Liquid Interdiffusion (ICV-SLID) is introduced. This is a chip-to-wafer stacking technology which combines the advantages of the Inter Chip Via (ICV) process and the solid-liquid-interdiffusion technique (SLID) of copper and tin. The fully modular ICV-SLID concept allows the formation of multiple device stacks. A test chip was designed and the total process sequence of the ICV-SLID technology for the realization of a three-layer chip-to-wafer stack was demonstrated. The proposed wafer-level 3D integration concept has the potential for low cost fabrication of multi-layer high-performance 3D-SoCs and is well suited as a replacement for embedded technologies based on monolithic integration. To address yield issues a wafer-level chip-scale handling is presented as well, to select known-good dies and work on them with wafer-level process sequences before joining them to integrated stacks.Comment: Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838

Quantum and Classical Chaos in Kicked Coupled Jaynes-Cummings Cavities

We consider two Jaynes-Cummings cavities coupled periodically with a photon hopping term. The semi-classical phase space is chaotic, with regions of stability over some ranges of the parameters. The quantum case exhibits dynamic localization and dynamic tunneling between classically forbidden regions. We explore the correspondence between the classical and quantum phase space and propose a scheme for implementing the system experimentally

Chaos assisted adiabatic passage

We study the exact dynamics underlying stimulated Raman adiabatic passage (STIRAP) for a particle in a multi-level anharmonic system (the infinite square-well) driven by two sequential laser pulses, each with constant carrier frequency. In phase space regions where the laser pulses create chaos, the particle can be transferred coherently into energy states different from those predicted by traditional STIRAP. It appears that a transition to chaos can provide a new tool to control the outcome of STIRAP

A new model-discriminant training algorithm for hybrid NN-HMM systems

This paper describes a hybrid system for continuous speech recognition consisting of a neural network (NN) and a hidden Markov model (HMM). The system is based on a multilayer perceptron, which approximates the a-posteriori probability of a sequence of states, derived from semi-continuous hidden Markov models. The classification is based on a total score for each hybrid model, attained from a Viterbi search on the state probabilities. Due to the unintended discrimination between the states in each model, a new training algorithm for the hybrid neural networks is presented. The utilized error function approximates the misclassification rate of the hybrid system. The discriminance between the correct and the incorrect models is optimized during the training by the "Generalized Probabilistic Descent Algorithm\u27;, resulting in a minimum classification error. No explicit target values for the neural net output nodes are used, as in the usual backpropagation algorithm with a quadratic error function. In basic experiments up to 56% recognition rate were achieved on a vowel classification task and up to 69 % on a consonant cluster classification task